12/06/2026
Tinning solder pads shouldn't risk the board. The YAXUN YX-671 tinning needle features a high-purity, gold-plated copper tip with a spherical head that fits precisely against pad edges, speeding up tinning by up to 80% without scratching the motherboard's copper foil. It's especially suited for BGA chips, phone card holders, and battery connectors, reaching into narrow gaps for even solder distribution. Watch the demo to see it work.
📩 Wholesale, distribution, and OEM welcome
☎ WhatsApp: +86 15088072933
🌐 www.yaxuntools.com | [email protected]